TSMC, Samsung commit to ASML’s newest chipmaking tools as AI drives demand
- ID
- 22281
- Status
- summarized
- Published
- 08 Sep 2026, 4:32 PM
- Fetched
- 08 Sep 2026, 4:55 PM
- Provider
- CNBC Technology
- Category
- technology
- Original URL
- https://www.cnbc.com/2026/09/08/tsmc-samsung-asml-high-na-euv-machine-ai-chips.html
- Source URL
- https://www.cnbc.com/id/19854910/device/rss/rss.html
Summary
- Score
- 4.0
- Created
- 08 Sep 2026, 4:55 PM
- Tags
- Audience
- developersai_ml_learnerssaas_founders
What happened
TSMC and Samsung have committed to using ASML's High NA EUV lithography machines, which cost around $400 million each, to produce more advanced AI chips. Samsung plans to adopt the technology in 2028 for DRAM memory manufacturing, while TSMC expects to use it in 2030 for advanced chips.
Why it matters
This sets the timeline for when next-generation chip density improvements will actually reach production—2028 for Samsung DRAM, 2030 for TSMC advanced logic. For anyone planning AI infrastructure or hardware-dependent products on a 2-4 year horizon, current process nodes are what you'll be shipping on; High NA EUV benefits won't materialize until late in the decade.
Discussion angle
What does a 2030 TSMC High NA EUV adoption timeline mean for AI compute cost trajectories—will software-level efficiency and model compression matter more than hardware density gains for the next several years?