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DateProviderScoreSummary
22 Oct 2026, 10:59 PMTechCrunch2.5 Fusion startup Helion is developing new semiconductors that could double output of its power plants

Helion received a three-year, $175M Department of Commerce award under the CHIPS Act to develop and manufacture advanced semiconductors and power electronics for its fusion plants. The devices currently lose 5%–10% of electricity, and CEO David Kirtley says halving that loss could double fusion output. Helion plans an automated module, packaging, and testing line in Washington State—described as the first U.S. line for this semiconductor class—while targeting its Orion plant and a 2028 Microsoft electricity deadline.

Why: No Malaysia/SEA angle is present, and there is no direct software or AI-agent action. The concrete item to track is whether the CHIPS-funded Washington line actually supplies Helion’s Orion plant by the 2028 Microsoft deadline; otherwise deprioritize it.

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